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Flexible Electronics for Security, Manufacturing, and Growth

in the United States





September 24, 2010


Room 100

The Keck Center of the National Academies

500 Fifth Street, NW

Washington, DC



9:00 AM          Welcome

                        Charles Wessner, The National Academies


9:05 AM          Introduction

                        Michael Andrews, L3 Communications                                        


9:15  AM              Panel I:  The Flexible Electronics Opportunity and Industry Challenges: Perspectives from Industry

            Moderator: Sridhar Kota, White House OSTP


The Promise and Potential of Flexible Electronics

Ross Bringans, PARC


Impact of a Flexible Form Factor for Displays and Lighting

Julia Brown, Universal Display Corporation                                 


Roll-to-Roll Fabrication of Transistor Arrays for Sensing and Display Applications

Carl Taussig, Hewlett-Packard                                        


10:30 AM        Coffee Break


10:45 AM        Panel II: The U.S. Interest: Security, Manufacturing, and Growth

            Moderator: Jon Epstein, Office of Senator Jeff Bingaman


Army Applications for Flexible Displays

John Pellegrino, U.S. Army Research Laboratory               


            The DARPA Role

Devanand Shenoy, DARPA                                          


The Technology Innovation Program: An Early Investor

Michael Schen, NIST                                                     


A State’s Initiative: Advancing Flexible Electronics in Ohio  

Byron Clayton, NorTech                                     


12:15 PM         Lunch


1:15 PM           Panel III:  What is the Rest of the World Doing?

Moderator: Pradeep Fulay, National Science Foundation                


A Global Perspective

Andrew Hannah, Plextronics


German Policy Initiatives

Christian May, Fraunhofer Institute, Dresden


Taiwan’s Flexible Electronics Program

                        John Chen, Industrial Technology and Research Institute of Taiwan


Korea’s Initiatives

Changhee Lee, Seoul National University


3:00 PM           Coffee Break


3:15 PM           Panel IV:  What is Needed? Opportunities for Collaborative Activity

            Moderator: Nick Colaneri, Arizona State University         


Road-mapping for Flexible Electronics

                        Dan Gamota, iNEMI                                       


                        The Consortium Opportunity

                        Malcolm Thompson, RPO


Cooperating on The Manufacturing Challenge

Thomas Edman, Applied Materials


4:15 PM           Panel V: Roundtable—Key Issues and Next Steps Forward

            Moderator: Don Siegel, University at Albany, SUNY


Ananth Dodabalapur, University of Texas at Austin

            Stephen Forrest, University of Michigan

            James Turner, Association of Public and Land Grant Universities


5:00 PM           Closing Remarks

                        Charles Wessner, The National Academies


Adjourn to Reception